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Construction and Status of the Origami Module Prototype
Gehalten von DI Christian Irmler am 10.07.2009 bei RIKEN @ Wako-shi, Saitama, Japan

Invited seminar talk about the status of the very first attemt to assemble an Origami Chip-on-Sensor Module.

 

* Overview of the origami chip-on-sensor concept and the future Belle II SVD layout.

* APV25 thinning results

* Step by step instruction of module assembly


Download: irmler_riken_20090710.ppt
Kategorie: anderer Vortrag