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The Silicon Vertex Detector of the Belle II Experiment
Gehalten von DI Dr. Thomas Bergauer am 24.05.2012 bei 12th Pisa Meeting on Advanced Detectors, Isola d'Elba

The Belle experiment at the KEK-B electron/positron collider in Tsukuba (Japan) has been successfully operating for more than ten years. A major update of the machine to SuperKEKB is now foreseen until 2014, aiming a peak luminosity which is 40 times the peak value of the previous system. This also requires a redesign of the Belle detector (leading to Belle II) and especially its Silicon Vertex Detector (SVD), which surrounds the beam pipe.


The future Belle II SVD will consist of four layers of double-sided silicon strip sensors, similar to what was implemented in the past, but the sensors will entirely be made from 6" silicon wafers. Moreover, an inner double-layer pixel detector based on DEPFET technology will complement the SVD as innermost detector and the SVD itself will now contain a forward part. Since the KEK B-factory operates at relatively low energy, material inside the active volume has to be minimized in order to reduce multiple scattering. This can be achieved by thin, double sided silicon sensors, which are arranged in the so-called "Origami chip-on-sensor concept", and a very light-weight mechanical support structure made from carbon fiber reinforced Airex foam. Moreover, CO2 cooling for the front-end chips will ensure high efficiency at minimum material budget.


In this talk, an overview of the future Belle II SVD design will be given, covering the silicon sensors, the readout electronics and the mechanics. A strong emphasis will be given to our R&D work on double sided sensors.

Download: bergauer_elba2012.pptx
Kategorie: Konferenzvortag (contributed)