- Versions
MAC-BOND-Interface PIC16C84 Software 5. 12. 1997
Version1 Recieve Byte - set Outputs - send OutputStatus Byte 16.6.1997 4MHz Version2-1 Recieve Byte - set Outputs - count Photointerrupter 5.5.1997 transitions - send transitions-count. 4MHzHS 2400Baud Version2-2 Recieve Byte - set Outputs - count Photointerrupter 5.5.1997 transitions - send transitions-count and PhotoStatus (1st/2nd Bond, Interrupted/Light) 10MHzHS 9600Baud Versin3-0 MacBond recieves commands and sets/reads Out/Inputs 16.5.1997 and sets bonds if it makes sense. Versin3-1 MacBond recieves commands and sets/reads Out/Inputs 26.5.1997 and sets bonds if it makes sense. Command setBond added. Wait1,2 for Set1st added Version3-2 Set1st and Set2nd Care_no_wire added 5.12.1997 SetBond: WAIT and actual status reported. ReadInputs -> ReadInOutput - OUT 4321 IN 4321 changed. Cmd-Word from 3 to 4 bit extented - CMDW xxxx. Version-info added Version3-3 SetBond0,1,2 delay time set to 160ms/cnt (2x80ms) 8. 5.1998 - Download
an555.zip Application note RS232 pic84pgm.zip PIC programmer mchipsof.ind AN index mpasm.exe Assembler pp.exe Programmer-SW pic.bat compile&download batch file 16c8x.hlp Help file cmdsv3-2.txt Function description vers3-2.ps Documentation 3-2 cmdsv3-3.txt Function description vers3-3.ps Documentation 3-3 16cxx.h rs232.h rcvr.asm txmtr.asm vers3-0.asm vers3-0.hex vers3-1.asm vers3-1.hex vers3-2.asm vers3-2.hex vers3-3.asm vers3-3.hex
| Bonding Station V1 .vi | Bonding Station V1 .LLB | simple output set | Documentation | Panel |
| Bonding Station V2.1 .vi | Bonding Station V2.1 .LLB | PIC-setbond commands | LabView-Documentation |  |
| MacBond Tool V1 | MacBondToolV1.llb | LabView-Documentation |  |
MicroChip PIC16C84 Appl. Notes (RS232)
National Instruments LabView